香港城市大學 2018 fall PhD - 留學
By Caitlin
at 2018-04-18T12:07
at 2018-04-18T12:07
Table of Contents
Joint PhD Project
City University of Hong Kong and National Tsing Hua University
PhD position opening:
A PhD position in City University of Hong Kong is available in the Department
of Mechanical and Biomedical Engineering (MBE) under the supervision of Dr.
Alice Hu.
Applicant conditions:
* Scholarship is fully funded for three (PhD) or four years (Master+PhD).
* Willing of locating half periods of time in Hong Kong
and half periods of time in Taiwan.
* Interviews are expected to take place in English via Skype.
Introduction:
Multiscale material research group focuses on ab-initio and molecular
dynamics. By joining our group, you will participate in very innovative and
fundamental material modeling and analysis technique. We are currently in a
strong collaboration with world-leading research groups of Prof. King-Ning Tu
( http://www.seas.ucla.edu/ethinfilm/professor.html ). The selected candidate
will work on the development of complex coding workflows to analyze 3D IC
packaging system level reliability with machine learning libraries. A
self-motivated, easy-going, and hard-working candidate is highly expected.
Eligibility criteria:
* Familiar in LINUX and coding (Fortran, C, python, perl, etc)
* Master degree in mathematics, physics, chemistry, materials science, or
related field is preferred,
while exceptional Bachelor degree holders are also welcome.
* English skills: IELTS>6.5, or TOEFL>79, or CET-6>490.
Contact:
Interested candidates can contact me (send CV, transcript, and English
certification), Dr. Jyh-Pin Chou, [email protected]
* 杜經寧老師(Prof. King-Ning Tu)為中央研究院院士,2016年於UCLA退休,
目前為交大材料科學與工程學系特聘講座教授
http://www.mse.nctu.edu.tw/teacher/ins.php?index_id=38
此篇雙邊連合博士學位(香港城市大學與台灣清華大學),未來題目將卓重
在透過 machine learning 研究 IC reliability,此研究將會與IC產業緊密結合。
若有任何細節上的問題,請直接與我聯絡(Dr. Jyh-Pin Chou)
--
City University of Hong Kong and National Tsing Hua University
PhD position opening:
A PhD position in City University of Hong Kong is available in the Department
of Mechanical and Biomedical Engineering (MBE) under the supervision of Dr.
Alice Hu.
Applicant conditions:
* Scholarship is fully funded for three (PhD) or four years (Master+PhD).
* Willing of locating half periods of time in Hong Kong
and half periods of time in Taiwan.
* Interviews are expected to take place in English via Skype.
Introduction:
Multiscale material research group focuses on ab-initio and molecular
dynamics. By joining our group, you will participate in very innovative and
fundamental material modeling and analysis technique. We are currently in a
strong collaboration with world-leading research groups of Prof. King-Ning Tu
( http://www.seas.ucla.edu/ethinfilm/professor.html ). The selected candidate
will work on the development of complex coding workflows to analyze 3D IC
packaging system level reliability with machine learning libraries. A
self-motivated, easy-going, and hard-working candidate is highly expected.
Eligibility criteria:
* Familiar in LINUX and coding (Fortran, C, python, perl, etc)
* Master degree in mathematics, physics, chemistry, materials science, or
related field is preferred,
while exceptional Bachelor degree holders are also welcome.
* English skills: IELTS>6.5, or TOEFL>79, or CET-6>490.
Contact:
Interested candidates can contact me (send CV, transcript, and English
certification), Dr. Jyh-Pin Chou, [email protected]
* 杜經寧老師(Prof. King-Ning Tu)為中央研究院院士,2016年於UCLA退休,
目前為交大材料科學與工程學系特聘講座教授
http://www.mse.nctu.edu.tw/teacher/ins.php?index_id=38
此篇雙邊連合博士學位(香港城市大學與台灣清華大學),未來題目將卓重
在透過 machine learning 研究 IC reliability,此研究將會與IC產業緊密結合。
若有任何細節上的問題,請直接與我聯絡(Dr. Jyh-Pin Chou)
--
Tags:
留學
All Comments
By Harry
at 2018-04-22T11:30
at 2018-04-22T11:30
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