清大動機系 免費短期課程(Introduction to MEMS and NEMS) - 課程

清華大學動力機械工程學系 短期課程
(本課程完全免費並提供上課講義)



課程名稱：Introduction to MEMS and NEMS

授課老師：林立偉 教授 Prof. Liwei Lin
清華大學動機系 講座教授（客座）
Chancellor’s Professor
Department of Mechanical Engineering
Co-Director, Berkeley Sensor and Actuator Center
University of California at Berkeley, USA

地點：清華大學工程一館 108室

時間：2009年9月8日 - 9月9日

課程資訊：http://www.pme.nthu.edu.tw/extra/class_info.php

報名：http://www.pme.nthu.edu.tw/extra/class_register.php

課程內容：

September 8, 2009 (Tuesday)

09:00 - 10:30 am Introduction to MEMS
10:30 - 11:00 am Break
11:00 - 12:30 pm Surface-Micromachining
12:30 - 01:30 pm Lunch
01:30 - 03:00 pm Bulk-Micromachining and Other Processes
03:00 - 03:30 pm Break
03:30 - 05:00 pm MEMS Packaging and Approaches


September 9, 2009 (Wednesday)

09:00 - 10:30 am Introduction to NEMS
10:30 - 11:00 am Break
11:00 - 12:30 pm 1-D Nanostructures – Carbon Nanotubes and Nanowires
12:30 - 01:30 pm Lunch
01:30 - 03:00 pm 0-D Nanostructures – Quantum Dots
03:00 - 03:30 pm Break
03:30 - 05:00 pm Open Discussions

Who Should Attend?
This short course targets students/researchers with no or minimum knowledge
in the areas of MEMS (Microelectromechanical Systems) and NEMS
(Nanoelectromechanical Systems). Attendees with basic understandings in
physics, chemistry and engineering mechanics, although not necessary, will be
helpful in understanding the course materials.

Course Description:
The course aims to provide basic knowledge of microelectromechanical systems
and nanoelectromechanical systems including design, fabrication of micro and
nanostructures’ various micro- and nano-machining processes; fabrication
principles of integrated circuit device and their applications for making
MEMS/NEMS devices; and device/system examples. During the first day of the
short course, an overview of MEMS manufacturing technologies and related
device manufacturing issues will be introduced at the beginning. Specific
MEMS fabrication processes such as surface- and bulk-micromachining processes
for key MEMS commercial products will then be addressed. Packaging related
topics such as hermetical sealing processes, accelerated testing and vacuum
encapsulation skills will be discussed, along with advanced approaches for
MEMS packaging and assembly, integration issues and future directions.
During the second day of the short course, nanofabrication technology will be
discussed, including how one achieves the nanometer length scale, including
"bottom up" and "top down" technologies; examples of nanoscience phenomena
(the crossover from bulk to quantum mechanical properties); and applications
(from integrated circuits, quantum computing, MEMS, and bioengineering).
An open discussion at the end will conclude the two-day short course.



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